Shenzhen Fuchangwei Technology Co., Ltd

Shenzhen Forewell Technology Co., Ltd

Manufacturer from China
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Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

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Shenzhen Fuchangwei Technology Co., Ltd
City:dongguan
Country/Region:china
Contact Person:Connie Zheng
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Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

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Brand Name :Forewell
Model Number :CMLO0520H
Certification :ISO9001,ISO14001
Place of Origin :China
MOQ :3000 pcs
Price :Negotiate
Payment Terms :T/T
Supply Ability :1000000 pcs per lot
Delivery Time :3-21days
Packaging Details :12000/BOX
Rated current :10A~3A
Package size :5.4*5.2*2.0mm
Application :Next-generation mobile devices
Shipping :DHL UPS FedEx EMS,By air or by sea
Inductance :0.68uH~10uH
Shape :or custom
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View Product Description

SMD Alloy Powder Molded Chip Power Inductor Drum Core Fixed Inductor For Mobile Devices 0.68uH~10uH

SMD Power Inductor Original Smd Alloy Powder Molded Chip Integrated Circuit Ic 1.0uH~4.7uH

Features:

  • Magnetically shielded construction, low DC resistance;
  • The use of magnetic iron powder ensure capability for large current;
  • Low audible core noise;
  • Ideal for DC-DC converter applications in hand held personal computer and etc;
  • Frequency Range: up to 29MHz;
  • RoHS compliant
  • Reliable quality

Applications:

  • Smart phone,MID;
  • Next-generation mobile devices with multifunction such as adding color TV and digital movie cameras;
  • Flat-screen TVs, blue-ray disc recorders, set top box;
  • Blue-ray disc recorders,
  • Telecomm base stations,communications.
  • Personal multimedia devices,consumer Products.
  • Telecomm base stations.
  • Communications

Specification:

tem Description
Category Molding Power Inductor
Inductance 10.68uH~10uH
Current Rating (Amps) 510A~3A
Size / Dimension 5.4*5.2*2.0mm
Material one-piece alloy powder

Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

Dimensions

Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

Specification

Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

Packaging Information:

Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

NOTES:

  • DC current (Idc) that will cause an approximate △T of 40℃
  • DC current (Isat) that will cause Lo to drop approximately 20%
  • All test data is referenced to 25℃ ambient
  • Operating Temperature Range -55℃ to +120℃
  • The part temperature (ambient + temp rise) should not exceed 120℃ under the worst operating conditions.
  • Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions
  • all affect the part temperature. Part temperature should be verified in the end application.

Packaging Quantity(pcs)

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